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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    APH-1732-G-T

    APH-1732-G-T

    APH-1732-G-T

    Samtec Inc.

    2,905
    APH-1732-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APO-640-G-T

    APO-640-G-T

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,836
    APO-640-G-T

    规格书

    APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    HLS-0316-G-32

    HLS-0316-G-32

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,466
    HLS-0316-G-32

    规格书

    HLS Tube Active SIP 48 (3 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    714-43-260-31-018000

    714-43-260-31-018000

    CONN IC DIP SOCKET 60POS GOLD

    Mill-Max Manufacturing Corp.

    4,821
    714-43-260-31-018000

    规格书

    714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 60 (2 x 30) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APH-0924-G-T

    APH-0924-G-T

    APH-0924-G-T

    Samtec Inc.

    1,709
    APH-0924-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1424-G-T

    APH-1424-G-T

    APH-1424-G-T

    Samtec Inc.

    1,080
    APH-1424-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1924-G-T

    APH-1924-G-T

    APH-1924-G-T

    Samtec Inc.

    3,274
    APH-1924-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1524-G-T

    APH-1524-G-T

    APH-1524-G-T

    Samtec Inc.

    4,132
    APH-1524-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0624-G-T

    APH-0624-G-T

    APH-0624-G-T

    Samtec Inc.

    1,838
    APH-0624-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1224-G-T

    APH-1224-G-T

    APH-1224-G-T

    Samtec Inc.

    3,794
    APH-1224-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0424-G-T

    APH-0424-G-T

    APH-0424-G-T

    Samtec Inc.

    4,457
    APH-0424-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0324-G-T

    APH-0324-G-T

    APH-0324-G-T

    Samtec Inc.

    1,903
    APH-0324-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    546-87-304-14-051147

    546-87-304-14-051147

    CONN SOCKET PGA 304POS GOLD

    Preci-Dip

    3,144
    546-87-304-14-051147

    规格书

    546 Bulk Active PGA 304 (14 x 14) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0420-G-2

    HLS-0420-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    1,014
    HLS-0420-G-2

    规格书

    HLS Bulk Active SIP 80 (4 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    HLS-0512-T-18

    HLS-0512-T-18

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,638
    HLS-0512-T-18

    规格书

    HLS Bulk Active SIP 60 (5 x 12) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    40-C182-21

    40-C182-21

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    1,147
    40-C182-21

    规格书

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    40-C182-31

    40-C182-31

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,821
    40-C182-31

    规格书

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    40-C212-21

    40-C212-21

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,665
    40-C212-21

    规格书

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    40-C212-31

    40-C212-31

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    2,863
    40-C212-31

    规格书

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    40-C300-31

    40-C300-31

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    2,322
    40-C300-31

    规格书

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
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