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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    110-13-950-61-001000

    110-13-950-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,797
    110-13-950-61-001000

    规格书

    110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-964-61-007000

    116-43-964-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,644
    116-43-964-61-007000

    规格书

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-964-61-007000

    116-93-964-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,829
    116-93-964-61-007000

    规格书

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0909-G-2

    HLS-0909-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,214
    HLS-0909-G-2

    规格书

    HLS Bulk Active SIP 81 (9 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    517-83-401-19-101111

    517-83-401-19-101111

    CONN SOCKET PGA 401POS GOLD

    Preci-Dip

    4,582
    517-83-401-19-101111

    规格书

    517 Bulk Active PGA 401 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    40-3572-11

    40-3572-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    3,268
    40-3572-11

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-6570-11

    40-6570-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    1,596
    40-6570-11

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-6571-11

    40-6571-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    1,177
    40-6571-11

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-6572-11

    40-6572-11

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    4,097
    40-6572-11

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-6575-11

    40-6575-11

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    3,955
    40-6575-11

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    558-10-192M16-001101

    558-10-192M16-001101

    PGA SOLDER TAIL 1.27MM

    Preci-Dip

    2,485
    558-10-192M16-001101

    规格书

    558 Bulk Active PGA 192 (16 x 16) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    326-93-164-41-003000

    326-93-164-41-003000

    SOCKET WRAP SOLDERTAIL SIP 64POS

    Mill-Max Manufacturing Corp.

    3,558
    326-93-164-41-003000

    规格书

    326 Tube Active SIP 64 (1 x 64) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    517-83-403-19-111111

    517-83-403-19-111111

    CONN SOCKET PGA 403POS GOLD

    Preci-Dip

    1,336
    517-83-403-19-111111

    规格书

    517 Bulk Active PGA 403 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-43-952-61-006000

    116-43-952-61-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,006
    116-43-952-61-006000

    规格书

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-952-61-006000

    116-93-952-61-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,022
    116-93-952-61-006000

    规格书

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-640-61-001000

    116-93-640-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,091
    116-93-640-61-001000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-650-61-007000

    116-93-650-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,393
    116-93-650-61-007000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    550-10-292M20-001166

    550-10-292M20-001166

    BGA PIN ADAPTER 1.27MM SMD

    Preci-Dip

    1,691
    550-10-292M20-001166

    规格书

    550 Bulk Active BGA 292 (20 x 20) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    232-1291-00-0602J

    232-1291-00-0602J

    CONN IC DIP SOCKET ZIF 32POS GLD

    3M

    3,278
    232-1291-00-0602J

    规格书

    Textool™ Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    115-43-964-61-001000

    115-43-964-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,319
    115-43-964-61-001000

    规格书

    115 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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