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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    85-PGM11007-10H

    85-PGM11007-10H

    CONN SOCKET PGA GOLD

    Aries Electronics

    2,019
    85-PGM11007-10H

    规格书

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    116-93-652-61-003000

    116-93-652-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,132
    116-93-652-61-003000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-648-61-007000

    116-93-648-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,604
    116-93-648-61-007000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APH-0930-G-R

    APH-0930-G-R

    APH-0930-G-R

    Samtec Inc.

    2,622
    APH-0930-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1430-G-R

    APH-1430-G-R

    APH-1430-G-R

    Samtec Inc.

    1,299
    APH-1430-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0530-G-R

    APH-0530-G-R

    APH-0530-G-R

    Samtec Inc.

    1,629
    APH-0530-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1030-G-R

    APH-1030-G-R

    APH-1030-G-R

    Samtec Inc.

    3,251
    APH-1030-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1630-G-R

    APH-1630-G-R

    APH-1630-G-R

    Samtec Inc.

    2,366
    APH-1630-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0730-G-R

    APH-0730-G-R

    APH-0730-G-R

    Samtec Inc.

    1,078
    APH-0730-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1130-G-R

    APH-1130-G-R

    APH-1130-G-R

    Samtec Inc.

    1,292
    APH-1130-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0830-G-R

    APH-0830-G-R

    APH-0830-G-R

    Samtec Inc.

    2,228
    APH-0830-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0230-G-R

    APH-0230-G-R

    APH-0230-G-R

    Samtec Inc.

    2,264
    APH-0230-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0330-G-R

    APH-0330-G-R

    APH-0330-G-R

    Samtec Inc.

    3,636
    APH-0330-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1730-G-R

    APH-1730-G-R

    APH-1730-G-R

    Samtec Inc.

    2,387
    APH-1730-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    123-13-952-41-001000

    123-13-952-41-001000

    CONN IC DIP SOCKET 52POS GOLD

    Mill-Max Manufacturing Corp.

    4,029
    123-13-952-41-001000

    规格书

    123 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-964-61-105000

    110-43-964-61-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,985
    110-43-964-61-105000

    规格书

    110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    48-3553-11

    48-3553-11

    CONN IC DIP SOCKET ZIF 48POS GLD

    Aries Electronics

    2,840
    48-3553-11

    规格书

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    116-93-950-61-006000

    116-93-950-61-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,245
    116-93-950-61-006000

    规格书

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-6508-211

    40-6508-211

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,703
    40-6508-211

    规格书

    508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    40-6508-311

    40-6508-311

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    2,781
    40-6508-311

    规格书

    508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
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