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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    APH-0624-G-H

    APH-0624-G-H

    APH-0624-G-H

    Samtec Inc.

    2,572
    APH-0624-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0224-G-H

    APH-0224-G-H

    APH-0224-G-H

    Samtec Inc.

    4,423
    APH-0224-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1624-G-H

    APH-1624-G-H

    APH-1624-G-H

    Samtec Inc.

    1,399
    APH-1624-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0724-G-H

    APH-0724-G-H

    APH-0724-G-H

    Samtec Inc.

    4,726
    APH-0724-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1724-G-H

    APH-1724-G-H

    APH-1724-G-H

    Samtec Inc.

    2,433
    APH-1724-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    40-9503-21

    40-9503-21

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,989
    40-9503-21

    规格书

    503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    40-9503-31

    40-9503-31

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,644
    40-9503-31

    规格书

    503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    510-41-144-15-082001

    510-41-144-15-082001

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    3,254
    510-41-144-15-082001

    规格书

    510 Bulk Active PGA 144 (15 x 15) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-652-61-007000

    116-43-652-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,340
    116-43-652-61-007000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-652-61-007000

    116-93-652-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,938
    116-93-652-61-007000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-93-964-61-001000

    111-93-964-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,671
    111-93-964-61-001000

    规格书

    111 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    7100265148

    7100265148

    TEXTOOLRECEPTACLES FOR DIP SOCKE

    3M

    4,542
    7100265148

    规格书

    - Bulk Active - - - - - - - - - - - - - - -
    116-93-648-61-008000

    116-93-648-61-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,697
    116-93-648-61-008000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    122-13-964-41-001000

    122-13-964-41-001000

    CONN IC DIP SOCKET 64POS GOLD

    Mill-Max Manufacturing Corp.

    1,861
    122-13-964-41-001000

    规格书

    122 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    323-13-164-41-001000

    323-13-164-41-001000

    SOCKET 3 LEVEL WRAPOST SIP 64POS

    Mill-Max Manufacturing Corp.

    3,213
    323-13-164-41-001000

    规格书

    323 Tube Active SIP 64 (1 x 64) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    517-87-599-54-131111

    517-87-599-54-131111

    CONN SOCKET PGA 599POS GOLD

    Preci-Dip

    1,483
    517-87-599-54-131111

    规格书

    517 Bulk Active PGA 599 (54 x 54) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-93-642-61-001000

    116-93-642-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,774
    116-93-642-61-001000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-6508-212

    40-6508-212

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    2,425
    40-6508-212

    规格书

    508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    40-6508-312

    40-6508-312

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,801
    40-6508-312

    规格书

    508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    116-43-950-61-003000

    116-43-950-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,730
    116-43-950-61-003000

    规格书

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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