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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    180-PGM18007-41

    180-PGM18007-41

    CONN SOCKET PGA GOLD

    Aries Electronics

    1,540
    180-PGM18007-41

    规格书

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    510-13-223-18-095001

    510-13-223-18-095001

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    2,169
    510-13-223-18-095001

    规格书

    510 Bulk Active PGA 223 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-83-628-41-001000

    210-83-628-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    1,226
    210-83-628-41-001000

    规格书

    210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 300.0µin (7.62µm) Brass Thermoplastic -55°C ~ 125°C
    110-83-628-41-001000

    110-83-628-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    2,622
    110-83-628-41-001000

    规格书

    - Tube Active - - - - - - - - - - - - - - -
    510-13-224-18-095002

    510-13-224-18-095002

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    4,434
    510-13-224-18-095002

    规格书

    510 Tube Active PGA 224 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-33-316-41-530000

    110-33-316-41-530000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,306
    110-33-316-41-530000

    规格书

    110 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-83-325-18-111144

    614-83-325-18-111144

    CONN SOCKET PGA 325POS GOLD

    Preci-Dip

    4,228
    614-83-325-18-111144

    规格书

    614 Bulk Active PGA 325 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    210-83-632-41-001000

    210-83-632-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    4,223
    210-83-632-41-001000

    规格书

    210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 300.0µin (7.62µm) Brass Thermoplastic -55°C ~ 125°C
    550-10-388M26-001152

    550-10-388M26-001152

    BGA SOLDER TAIL

    Preci-Dip

    3,432
    550-10-388M26-001152

    规格书

    550 Bulk Active BGA 388 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    546-83-447-20-121147

    546-83-447-20-121147

    CONN SOCKET PGA 447POS GOLD

    Preci-Dip

    3,490
    546-83-447-20-121147

    规格书

    546 Bulk Active PGA 447 (20 x 20) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    132-PGM13079-10H

    132-PGM13079-10H

    CONN SOCKET PGA GOLD

    Aries Electronics

    2,154
    132-PGM13079-10H

    规格书

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    132-PGM14015-10H

    132-PGM14015-10H

    CONN SOCKET PGA GOLD

    Aries Electronics

    3,301
    132-PGM14015-10H

    规格书

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    210-33-320-41-101000

    210-33-320-41-101000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,046
    210-33-320-41-101000

    规格书

    210 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    36-6556-41

    36-6556-41

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    2,324
    36-6556-41

    规格书

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    550-10-560M33-001166

    550-10-560M33-001166

    BGA PIN ADAPTER 1.27MM SMD

    Preci-Dip

    3,483
    550-10-560M33-001166

    规格书

    550 Bulk Active BGA 560 (33 x 33) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    110-33-624-41-530000

    110-33-624-41-530000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,446
    110-33-624-41-530000

    规格书

    110 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    133-PGM13052-10H

    133-PGM13052-10H

    CONN SOCKET PGA GOLD

    Aries Electronics

    3,779
    133-PGM13052-10H

    规格书

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    133-PGM13067-10H

    133-PGM13067-10H

    CONN SOCKET PGA GOLD

    Aries Electronics

    1,559
    133-PGM13067-10H

    规格书

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    133-PGM14013-10H

    133-PGM14013-10H

    CONN SOCKET PGA GOLD

    Aries Electronics

    3,457
    133-PGM14013-10H

    规格书

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    210-83-640-41-001000

    210-83-640-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    3,610
    210-83-640-41-001000

    规格书

    210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 300.0µin (7.62µm) Brass Thermoplastic -55°C ~ 125°C
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