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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    110-83-640-41-001000

    110-83-640-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    2,679
    110-83-640-41-001000

    规格书

    - Tube Active - - - - - - - - - - - - - - -
    100-PRS10001-12

    100-PRS10001-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    1,567
    100-PRS10001-12

    规格书

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    40-6556-40

    40-6556-40

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    2,799
    40-6556-40

    规格书

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    514-83-420M26-001148

    514-83-420M26-001148

    CONN SOCKET BGA 420POS GOLD

    Preci-Dip

    4,295
    514-83-420M26-001148

    规格书

    514 Bulk Active BGA 420 (26 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    550-10-381-18-101135

    550-10-381-18-101135

    PGA SOLDER TAIL

    Preci-Dip

    4,077
    550-10-381-18-101135

    规格书

    550 Bulk Active PGA 381 (18 x 18) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0520-T-18

    HLS-0520-T-18

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,501
    HLS-0520-T-18

    规格书

    HLS Bulk Active SIP 100 (5 x 20) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    614-83-320-19-131144

    614-83-320-19-131144

    CONN SOCKET PGA 320POS GOLD

    Preci-Dip

    3,275
    614-83-320-19-131144

    规格书

    614 Bulk Active PGA 320 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    558-10-352M26-001104

    558-10-352M26-001104

    BGA SURFACE MOUNT 1.27MM

    Preci-Dip

    3,871
    558-10-352M26-001104

    规格书

    558 Bulk Active BGA 352 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    132-PGM13038-50

    132-PGM13038-50

    CONN SOCKET PGA GOLD

    Aries Electronics

    4,530
    132-PGM13038-50

    规格书

    PGM - Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    614-83-321-19-121144

    614-83-321-19-121144

    CONN SOCKET PGA 321POS GOLD

    Preci-Dip

    2,037
    614-83-321-19-121144

    规格书

    614 Bulk Active PGA 321 (21 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    518-77-352M26-001105

    518-77-352M26-001105

    CONN SOCKET PGA 352POS GOLD

    Preci-Dip

    3,597
    518-77-352M26-001105

    规格书

    518 Bulk Active PGA 352 (26 x 26) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    110-33-314-41-001000

    110-33-314-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    2,876
    110-33-314-41-001000

    规格书

    - Tube Active - - - - - - - - - - - - - - -
    44-536-11

    44-536-11

    CONN SOCKET PLCC ZIF 44POS GOLD

    Aries Electronics

    2,589
    44-536-11

    规格书

    536 - Obsolete PLCC, ZIF (ZIP) 44 (4 x 11) 0.050" (1.27mm) Gold 12.0µin (0.30µm) - Through Hole Open Frame - - - - - - -
    32-3574-16

    32-3574-16

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    3,316
    32-3574-16

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    558-10-356M26-001104

    558-10-356M26-001104

    BGA SURFACE MOUNT 1.27MM

    Preci-Dip

    3,814
    558-10-356M26-001104

    规格书

    558 Bulk Active BGA 356 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    550-10-400M20-000152

    550-10-400M20-000152

    BGA SOLDER TAIL

    Preci-Dip

    4,121
    550-10-400M20-000152

    规格书

    550 Bulk Active BGA 400 (20 x 20) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    546-83-463-19-101147

    546-83-463-19-101147

    CONN SOCKET PGA 463POS GOLD

    Preci-Dip

    4,164
    546-83-463-19-101147

    规格书

    546 Bulk Active PGA 463 (19 x 19) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    558-10-357M19-001104

    558-10-357M19-001104

    BGA SURFACE MOUNT 1.27MM

    Preci-Dip

    3,459
    558-10-357M19-001104

    规格书

    558 Bulk Active BGA 357 (19 x 19) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    550-10-576M30-001166

    550-10-576M30-001166

    BGA PIN ADAPTER 1.27MM SMD

    Preci-Dip

    3,802
    550-10-576M30-001166

    规格书

    550 Bulk Active BGA 576 (30 x 30) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    518-77-356M26-001105

    518-77-356M26-001105

    CONN SOCKET PGA 356POS GOLD

    Preci-Dip

    3,636
    518-77-356M26-001105

    规格书

    518 Bulk Active PGA 356 (26 x 26) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
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