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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    518-77-357M19-001105

    518-77-357M19-001105

    CONN SOCKET PGA 357POS GOLD

    Preci-Dip

    1,772
    518-77-357M19-001105

    规格书

    518 Bulk Active PGA 357 (19 x 19) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    110-33-628-41-530000

    110-33-628-41-530000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    4,954
    110-33-628-41-530000

    规格书

    110 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-33-628-41-101000

    210-33-628-41-101000

    SOCKET IC CLOSED FRM .300 28POS

    Mill-Max Manufacturing Corp.

    2,456
    210-33-628-41-101000

    规格书

    210 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-33-316-41-001000

    210-33-316-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    4,417
    210-33-316-41-001000

    规格书

    210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Thermoplastic -55°C ~ 125°C
    110-33-316-41-001000

    110-33-316-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    1,717
    110-33-316-41-001000

    规格书

    - Tube Active - - - - - - - - - - - - - - -
    36-3551-16

    36-3551-16

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    2,335
    36-3551-16

    规格书

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    558-10-360M19-001104

    558-10-360M19-001104

    BGA SURFACE MOUNT 1.27MM

    Preci-Dip

    1,525
    558-10-360M19-001104

    规格书

    558 Bulk Active BGA 360 (19 x 19) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    518-77-352M26-001106

    518-77-352M26-001106

    CONN SOCKET PGA 352POS GOLD

    Preci-Dip

    3,618
    518-77-352M26-001106

    规格书

    518 Bulk Active PGA 352 (26 x 26) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    1109042

    1109042

    537 ZIF TEST SCKT LIVE BUG TYPE

    Aries Electronics

    4,517
    1109042

    规格书

    - - Active - - - - - - - - - - - - - - -
    514-83-432M31-001148

    514-83-432M31-001148

    CONN SOCKET BGA 432POS GOLD

    Preci-Dip

    2,731
    514-83-432M31-001148

    规格书

    514 Bulk Active BGA 432 (31 x 31) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    518-77-360M19-001105

    518-77-360M19-001105

    CONN SOCKET PGA 360POS GOLD

    Preci-Dip

    3,105
    518-77-360M19-001105

    规格书

    518 Bulk Active PGA 360 (19 x 19) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    514-87-560M33-001148

    514-87-560M33-001148

    CONN SOCKET BGA 560POS GOLD

    Preci-Dip

    2,332
    514-87-560M33-001148

    规格书

    514 Bulk Active BGA 560 (33 x 33) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    210-33-320-41-001000

    210-33-320-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    1,344
    210-33-320-41-001000

    规格书

    - Tube Active - - - - - - - - - - - - - - -
    518-77-356M26-001106

    518-77-356M26-001106

    CONN SOCKET PGA 356POS GOLD

    Preci-Dip

    2,725
    518-77-356M26-001106

    规格书

    518 Bulk Active PGA 356 (26 x 26) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    281-PGM18037-11

    281-PGM18037-11

    CONN SOCKET PGA GOLD

    Aries Electronics

    4,593
    281-PGM18037-11

    规格书

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    210-33-632-41-101000

    210-33-632-41-101000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,790
    210-33-632-41-101000

    规格书

    210 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-33-318-41-001000

    110-33-318-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    2,173
    110-33-318-41-001000

    规格书

    - Tube Active - - - - - - - - - - - - - - -
    210-33-318-41-001000

    210-33-318-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    4,494
    210-33-318-41-001000

    规格书

    - Tube Active - - - - - - - - - - - - - - -
    518-77-357M19-001106

    518-77-357M19-001106

    CONN SOCKET PGA 357POS GOLD

    Preci-Dip

    2,954
    518-77-357M19-001106

    规格书

    518 Bulk Active PGA 357 (19 x 19) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    558-10-388M26-001101

    558-10-388M26-001101

    PGA SOLDER TAIL 1.27MM

    Preci-Dip

    4,287
    558-10-388M26-001101

    规格书

    558 Bulk Active PGA 388 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
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