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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    32-6551-16

    32-6551-16

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    3,573
    32-6551-16

    规格书

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    223-83-964-41-101000

    223-83-964-41-101000

    SKT IC CLOSED

    Mill-Max Manufacturing Corp.

    4,006
    223-83-964-41-101000

    规格书

    223 Bulk Obsolete DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) - - Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    518-77-360M19-001106

    518-77-360M19-001106

    CONN SOCKET PGA 360POS GOLD

    Preci-Dip

    4,309
    518-77-360M19-001106

    规格书

    518 Bulk Active PGA 360 (19 x 19) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    36-6572-16

    36-6572-16

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    4,530
    36-6572-16

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    290-1294-00-3302J

    290-1294-00-3302J

    CONN IC DIP SOCKET ZIF 90POS GLD

    3M

    4,725
    290-1294-00-3302J

    规格书

    Textool™ Bulk Active DIP, ZIF (ZIP) 90 (2 x 45) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    110-33-640-41-530000

    110-33-640-41-530000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,032
    110-33-640-41-530000

    规格书

    110 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-33-640-41-101000

    210-33-640-41-101000

    SOCKET IC CLOSED FRM .600 28POS

    Mill-Max Manufacturing Corp.

    1,988
    210-33-640-41-101000

    规格书

    210 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    550-10-600M35-001166

    550-10-600M35-001166

    BGA PIN ADAPTER 1.27MM SMD

    Preci-Dip

    1,845
    550-10-600M35-001166

    规格书

    550 Bulk Active BGA 600 (35 x 35) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    514-87-576M30-001148

    514-87-576M30-001148

    CONN SOCKET BGA 576POS GOLD

    Preci-Dip

    2,260
    514-87-576M30-001148

    规格书

    514 Bulk Active BGA 576 (30 x 30) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    48-6556-41

    48-6556-41

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    4,768
    48-6556-41

    规格书

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    550-10-420M26-001152

    550-10-420M26-001152

    BGA SOLDER TAIL

    Preci-Dip

    4,059
    550-10-420M26-001152

    规格书

    550 Bulk Active BGA 420 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    40-6554-16

    40-6554-16

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    4,991
    40-6554-16

    规格书

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-3553-16

    40-3553-16

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    3,780
    40-3553-16

    规格书

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    64-9508-21

    64-9508-21

    CONN IC DIP SOCKET 64POS GOLD

    Aries Electronics

    2,928
    64-9508-21

    规格书

    508 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    64-9508-31

    64-9508-31

    CONN IC DIP SOCKET 64POS GOLD

    Aries Electronics

    2,301
    64-9508-31

    规格书

    508 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    169-PGM13001-51

    169-PGM13001-51

    CONN SOCKET PGA GOLD

    Aries Electronics

    1,719
    169-PGM13001-51

    规格书

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    558-10-400M20-000101

    558-10-400M20-000101

    PGA SOLDER TAIL 1.27MM

    Preci-Dip

    4,693
    558-10-400M20-000101

    规格书

    558 Bulk Active PGA 400 (20 x 20) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    36-3570-16

    36-3570-16

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    1,307
    36-3570-16

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    210-33-314-41-001000

    210-33-314-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    3,458
    210-33-314-41-001000

    规格书

    210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Thermoplastic -55°C ~ 125°C
    514-83-456M26-001148

    514-83-456M26-001148

    CONN SOCKET BGA 456POS GOLD

    Preci-Dip

    4,367
    514-83-456M26-001148

    规格书

    514 Bulk Active BGA 456 (26 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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